1 note: this is a summary document. a complete document is not available at this time. for more information, please contact your local atmel sales office. 5344as?bdc?09/03 main features programmable dmux ratio: ? 1:4 data rate max = 1 gsps ?p d (8b/10b) < 4.3/4.7 w (ecl 50 ? output) ? 1:8 data rate max = 2 gsps ?p d (8b/10b) < 6/6.9 w (ecl 50 ? output) ? 1:16 with 1 ts8388b or 1 ts83102g0 and 2 dmux parallel output mode 8/10-bit ecl differential input data data ready or data ready 2 input clock input clock sampling delay adjust single-ended output data: ? adjustable common mode and swing ? logic threshold reference output ? ecl, pecl, ttl asynchronous reset synchronous reset adc and dmux multi-channel applications: ? stand-alone delay adjust cell for adcs sampling instant alignment differential data ready output built-in self test (bist) dual power supply v ee = -5 v, v cc = 5 v radiation tolerance oriented design (more than 100 krad (si) expected) thermally enhanced cqfp196 cavity up package screening temperature range: ? c grade: 0c < tc; tj < 90c ? v grade: -40c < tc; tj < 110c ? m grade: -55c < tc; tj < 125c standard screening level for ?c?, ?v? and ?m? grades esa scc 9000 space screening flow for ?m? grade (on request) note: for commercial and industrial temperatur e ranges the dmux is also available in a tbga240 package (p/n: ts81102g0ctp and ts81102g0vtp). description the ts81102g0 is a monolithic 10-bit high-speed (up to 2 gsps) demultiplexer. the dmux is designed to run with all kinds of adcs and more specifically, it fits per- fectly with atmel?s high-speed adc 8-bit 1 gsps ts8388b and adc 10-bit 2 gsps ts83102g0b. the ts81102g0 uses an innovative architecture, including a sampling delay adjust and tunable output levels. this dmux allows users to process the high- speed output data stream down to st andard signal processors speed (standard fpgas). 1:4/1:8 8/10-bit 2 gsps dmux TS81102G0FS target specification summary for more information please contact hotline-bdc@gfo.atmel.com
2 TS81102G0FS 5344as?bdc?09/03 package description table 1. pin description symbol pin number description power supplies v cc 5, 127 positive 5 v power supply v ee 1, 10, 16, 22, 28, 34, 40, 46, 58, 73, 92, 112, 123, 141, 155, 172, 189, 196 negative -5 v power supply v plusd 53, 61, 64, 69, 78, 83, 87, 95, 98, 101, 102, 106, 109, 115, 122, 126, 130, 133, 136, 144, 145, 148, 152, 160, 163, 167, 177, 181, 184, 193 output buffer power supply gnd 2, 7, 13, 19, 25, 31, 37, 43, 49, 50, 99, 100, 118, 128, 146, 147 ground analog input signals dmuxdeladjctrl 194 in-phase dmux clock delay cell control signal dmuxdeladjctrlb 195 inverted phase dmux clock delay cell control signal adcdeladjctrl 47 in-phase stand-alone delay cell control signal adcdeladjctrlb 48 inverted phase stand-alone delay cell control signal swiadj 121 swing adjust function control signal diode 6 die junction temperature monitoring signal ecl input signals clkin 21 in-phase input clock signal clkinb 20 inverted phase input clock signal i[0?9] 9, 12, 15, 18, 24, 27, 30, 33, 36, 39 in-phase input data i[0?9]b 8, 11, 14, 17, 23, 26, 29, 32, 35, 38 inverted phase input data syncreset 4 in-phase synchronous reset syncresetb 3 inverted phase synchronous reset adcdeladjin 44 in-phase input of the stand-alone delay cell adcdeladjinb 45 inverted phase input of the stand-alone delay cell
3 TS81102G0FS 5344as?bdc?09/03 output data a[0?9] b[0?9] c[0?9] d[0?9] e[0?9] f[0?9] g[0?9] h[0?9] 179, 180, 182, 183, 185, 186, 187, 188, 190, 191 56, 57, 59, 60, 62, 63, 65, 66, 67, 68 165, 166, 168, 169, 170, 171, 173, 174, 175, 176 71, 72, 74, 75, 76, 77, 79, 80, 81, 82 150, 151, 153, 154, 156, 157, 158, 159, 161, 162 85, 86, 88, 89, 90, 91, 93, 94, 96, 97 131, 132, 134, 135, 137, 138, 139, 140, 142, 143 104, 105, 107, 108, 110, 111, 113, 114, 116, 117 output data refa to refh 178, 55, 16 4, 70, 149, 84, 129, 103 reference outputs (tied to the common mode voltage of each port) dr 125 in-phase data ready signal (centered in the output data, frequency = output data frequency/2) drb 124 inverted phase data ready signal (centered in the output data, frequency = output data frequency /2) ttl input signals asyncreset 192 asynchronous reset (active high) clkintype 51 input clock type: dr mode = logic 1 dr/2 mode = logic 0 ratiosel 120 dmux ratio selection: 1:4 mode = logic 1 1:8 mode = logic 0 nbbit 52 number of bits selection 10 bits = logic 1 8 bits = logic 0 bist 54 built-in self-test mode (active low) other output signals adcdeladjout 41 in-phase output of the stand-alone delay cell adcdeladjoutb 42 inverted phase output of the stand-alone delay cell table 1. pin description (continued)
4 TS81102G0FS 5344as?bdc?09/03 figure 1. pinout top view top view
5 TS81102G0FS 5344as?bdc?09/03 figure 2. cqfp 196 package top view note: package: black ai203 ceramic leads: kovar, ni and au plating lid: kovar, ni and au plating heatspreader on bottom: cuw with ni and au plating 18.54 mm 18.54 mm pin 1 index 0.230 mm + 0.050/-0.038 lead width (196x) 0.635 mm pitch chamfer 0.5 0.25 lands for capacitor (chip size 0603) chamfer 0.76 0.25 (x3) 33.91 mm 0.10 mm 38.80 mm 0.18 mm 33.91 mm 0.10 mm 38.80 mm 0.18 mm
6 TS81102G0FS 5344as?bdc?09/03 figure 3. cqfp 196 on-package capacitor location note: the on-package decoupling capacitors are an option on ly. their use will be confirmed after full characterization. 1 nf 1 nf 1 nf 1 nf 2.200 mm 2.760 mm 0.900 mm 16.010 mm 2.760 mm 2.200 mm 0.900 mm 16.340 mm 16.610 mm 0.900 mm 2.200 mm 2.760 mm 16.780 mm 0.900 mm 2.760 mm 2.200 mm
7 TS81102G0FS 5344as?bdc?09/03 figure 4. detailed cross section of demux in cqfp196 package note: the on-package decoupling capacitors are an option only. thei r use will be confirmed after full characterization of the pa ckaged device. 9.27 (combo 18.54 sq) lid 0.38 thickness + 0.05 solder 18.54 mm 2 lid, 16.51 mm 2 inner (0.381) die: 0.380 (0.35 x 2) (0.20) (0.10 x 3 + 0.20) (0.50) 22.86 mm 2 cuw heatspreader seating plane 19.4 mm ref (38.8/2 mm tip-to-tip) all dimensions in mm 0.817 4? 7.25? 127 m thick lead (ref) (230 m width) overall height 3.47 mm ref/3.90 mm max. 2.620 mm capacitor 0.8 mm thick (soldered on top) 1.90 0.20 mm 0.510 mm 0.010 mm 0.51 mm 0.200 mm 0.150 mm 9.27 (combo 18.54 sq) lid 0.38 thickness + 0.05 solder 18.54 mm 2 lid, 16.51 mm 2 inner (0.381) die: 0.380 cuw heatspreader seating plane 19.4 mm ref (38.8/2 mm tip-to-tip) 127 m thick lead (ref) (230 m width) 4? 7.25? overall height 3.05 mm ref/3.40 mm max. 2.620 mm all dimensions in mm 0.817 1.90 0.20 mm 0.510 mm 0.010 mm (0.35 x 2) (0.20) (0.10 x 3 + 0.20) (0.50) 0.51 mm 0.200 mm 0.150 mm 22.86 mm 2
8 TS81102G0FS 5344as?bdc?09/03 figure 5. thermal characteristics thermal resistance junction to bottom of case = 0.26 + 0.31 + 1.44 + 0.07 + 0.07 = 2.15?c/watt (customer thermal interface excluded) estimated thermal model for 196 cqfp-cuw bottom of leads board at bottom of leads 47.7 ?c/watt = 0.17 w/cm/?c lid : kovar cuw b ase thermal interface (customer) cuw base silver glass silicon die 7 x 7=49 mm 2 0.07?c/watt (typical values) = 1.8 w/cm/?c = 0.2 w/cm/?c al2o3 = 0.17 w/cm/?c = 0.95 w/cm/?c heating zone = 3.5 x 3.5 mm2 demux cuw b ase board at bottom of package bottom of package 2.3?c/watt al2o3 3.0?c/watt 0.31?c/watt 1.44?c/watt 0.07?c/watt 0.26?c/watt silicon junction lid top 0.3?c/watt 0.6?c/watt al2o3 kovar leads 127 m x 230 m = 0.17 w/cm/?c
9 TS81102G0FS 5344as?bdc?09/03 ordering information table 2. ordering information part number package temperature range screening comments ts81102g0cfs cqfp 196 ?c? grade 0c < tc; tj < 90c standard ts81102g0vfs cqfp 196 ?v? grade -40c < tc; tj < 110c standard ts81102g0mfs cqfp 196 ?m? grade -55c < tc; tj < 125c standard ts81102g0mfs9nxy cqfp 196 ?m? grade -55c < tc; tj < 125c esa/scc9000 screening non esa/scc qualified x = b or c for respectively level b or c of esa/scc9000 y = 1, 2 or 3 for respectively lot acceptance test 1, 2 or 3 please contact marketing
printed on recycled paper. disclaimer: atmel corporation makes no warranty for the use of its products, other than those expr essly contained in the company?s standar d warranty which is detailed in atmel?s terms and conditions locat ed on the company?s web site. the company assumes no responsibi lity for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time wi thout notice, and does not make any commitment to update the information contained her ein. no licenses to patents or other intellectual property of atmel are granted by the company in connection with the sale of atmel produc ts, expressly or by implication. atmel?s products are not aut horized for use as critical components in life support devices or systems. atmel corporation atmel operations 2325 orchard parkway san jose, ca 95131, usa tel: 1(408) 441-0311 fax: 1(408) 487-2600 regional headquarters europe atmel sarl route des arsenaux 41 case postale 80 ch-1705 fribourg switzerland tel: (41) 26-426-5555 fax: (41) 26-426-5500 asia room 1219 chinachem golden plaza 77 mody road tsimshatsui east kowloon hong kong tel: (852) 2721-9778 fax: (852) 2722-1369 japan 9f, tonetsu shinkawa bldg. 1-24-8 shinkawa chuo-ku, tokyo 104-0033 japan tel: (81) 3-3523-3551 fax: (81) 3-3523-7581 memory 2325 orchard parkway san jose, ca 95131, usa tel: 1(408) 441-0311 fax: 1(408) 436-4314 microcontrollers 2325 orchard parkway san jose, ca 95131, usa tel: 1(408) 441-0311 fax: 1(408) 436-4314 la chantrerie bp 70602 44306 nantes cedex 3, france tel: (33) 2-40-18-18-18 fax: (33) 2-40-18-19-60 asic/assp/smart cards zone industrielle 13106 rousset cedex, france tel: (33) 4-42-53-60-00 fax: (33) 4-42-53-60-01 1150 east cheyenne mtn. blvd. colorado springs, co 80906, usa tel: 1(719) 576-3300 fax: 1(719) 540-1759 scottish enterprise technology park maxwell building east kilbride g75 0qr, scotland tel: (44) 1355-803-000 fax: (44) 1355-242-743 rf/automotive theresienstrasse 2 postfach 3535 74025 heilbronn, germany tel: (49) 71-31-67-0 fax: (49) 71-31-67-2340 1150 east cheyenne mtn. blvd. colorado springs, co 80906, usa tel: 1(719) 576-3300 fax: 1(719) 540-1759 biometrics/imagin g/hi-rel mpu/ high speed converters/rf datacom avenue de rochepleine bp 123 38521 saint-egreve cedex, france tel: (33) 4-76-58-30-00 fax: (33) 4-76-58-34-80 literature requests www.atmel.com/literature 5344as?bdc?09/03 0m ? atmel corporation 2003 . all rights reserved. atmel ? and combinations thereof are the registered trade- marks of atmel corporation or its subsidiaries. other terms and product names may be the trademarks of others.
|
